型号 |
品牌 |
批号 |
封装 |
数量 |
简介 |
SI8230BD-D-IS |
SKYWORKS |
22+ |
16-SOIC |
2500 |
16-SOIC (0.295", 7.50mm Width) Surface Mount 5000Vrms 20ns, 20ns (Max) 9.4V ~ 24V |
K4B2G1646F-BYMA000 |
SAMSUNG |
22+ |
FBGA-96 |
4480 |
128*16 DDR3L |
C6D04065A |
CREE |
22+ |
TO-220-2 |
2500 |
TO-220-2 SIC 4000mA 650V 1.27V@4000mA |
K4B2G1646F-BCNB |
SAMSUNG |
22+ |
BGA96 |
5600 |
SSTL_1.5 128*16 DDR3L |
FSB117HNY |
ON |
22+ |
DIP |
2500 |
1 DIP |
K4B2G0846F-BYMA |
SAMSUNG |
22+ |
FBGA |
5600 |
DRAM Chip DDR3L SDRAM 2Gbit 256Mx8 1.35V/1.5V 78-Pin FBGA |
1N4148T26 |
ON |
22+ |
DO35 |
2500 |
|
K4B4G1646E-BYMA |
SAMSUNG |
22+ |
FBGA |
5600 |
1.35|1.5V 256*16 DDR3L |
BSC050N10NS5ATMA1 |
INFINEON |
22+ |
PowerTDFN-8 |
2500 |
N-Channel 100V 16000mA(TA),100000mA(TC) 6V,10V 0.005Ω@50000mA,10V 20V,-20V 3W(TA),136W(TC) -55°C~175°C(TJ) PowerTDFN-8 |
K4B4G1646E-BCNB |
SAMSUNG |
22+ |
FBGA |
5600 |
SSTL_1.5 1.5V 256*16 DDR3L |