| 型号 | 品牌 | 批号 | 封装 | 数量 | 简介 |
|---|---|---|---|---|---|
| KLM4G1FETE-B041 | SAMSUNG | 22+ | BGA153 | 6000 | Serial e-MMC MLC v5.1 4GB |
| FAN7382MX | ON | 22+ | 8-SOIC | 4000 | Half-Bridge IGBT, N-Channel MOSFET 350mA, 650mA 8-SOIC (0.154", 3.90mm Width) Exposed Pad 10V ~ 20V 0.8V, 2.5V 600V |
| KLM8G1GETF-B041 | SAMSUNG | 22+ | BGA153 | 2240 | Serial e-MMC 1.8|3.3V MLC v5.1 8GB |
| FDS6679AZ | ON | 22+ | SOIC-8 | 3000 | P-Channel 30V 13000mA(TA) 4.5V,10V 0.0093Ω@13000mA,10V 25V,-25V 2.5W(TA) -55°C~150°C(TJ) SOIC-8(3.90mm ) |
| KLMAG1JETD-B041 | SAMSUNG | 22+ | BGA153 | 3360 | Serial e-MMC MLC v5.1 16GB |
| CSD17576Q5B | TI | 22+ | PowerTDFN-8 | 2000 | PowerTDFN-8 -55°C~150°C(TJ) N-Channel 100000mA(TA) 0.002Ω@25000mA,10V 3.1W(TA),125W(TC) 20V,-20V 30V |
| KLMBG2JETD-B041 | SAMSUNG | 22+ | BGA153 | 3360 | eMMC architecture for embedded memory MLC v5.1 32GB |
| FAN6300AMY | ON | 22+ | 8-SOIC | 5000 | 8-SOIC (0.154", 3.90mm Width) Flyback -40°C ~ 105°C (TA) 8V ~ 25V |
| KLMCG4JETD-B041 | SAMSUNG | 22+ | BGA153 | 2240 | MLC v5.1 64GB |
| CAT809TTBI-GT3 | ON | 22+ | SOT-23-3 | 6000 | TO-236-3, SC-59, SOT-23-3 Push-Pull, Totem Pole Simple Reset/Power-On Reset 1 3.08V |
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