型号 | 品牌 | 批号 | 封装 | 数量 | 简介 |
---|---|---|---|---|---|
TDA2SXBUQABCRQ1 | TI | 22+ | SMD | 2500 | |
K4F6E3S4HM-MGCJ | SAMSUNG | 22+ | BGA | 1280 | LVSTL LPDDR4 512*32 |
DRA745BLGABCRQ1 | TI | 22+ | FCBGA-760 | 2500 | Dual 1.2 GHz Arm Cortex-A15 SoC processor with graphics & DSP for automotive infotainment & cluster 760-FCBGA -40 to 125 |
K4FBE3D4HM-MGCJ | SAMSUNG | 22+ | BGA | 1280 | DRAM Chip Mobile LPDDR4 SDRAM 32Gbit 1Gx32 1.1V/1.1V/1.8V |
FS32R274KSK2MMM | NXP | 22+ | 257-LFBGA | 2500 | 257-LFBGA 180MHz, 240MHz 1.5M x 8 FLASH e200z4, e200z7 (2) 32-Bit Tri-Core CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire 2MB (2M x 8) 64K x 8 1.19V ~ 5.5V |
K4U6E3S4AA-MGCL | SAMSUNG | 22+ | BGA | 1280 | LPDDR4X 16Gbit |
NCV81277MNTXG | ON | 22+ | QFN | 2500 | |
MAX96718FGTM/VY+T | MAXIM | 22+ | QFN44 | 2500 | |
R7F701408EABG-C#BC1 | RENESAS | 22+ | BGA376 | 2500 | |
88Q2112-A2-NYD2A000- | MARVELL | 22+ | QFN48 | 2500 |