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型号	品牌	批号	封装	数量	简介
BZX384-B5V1	NEXPERIA	22+	SOD323󋭔󅄅󋭔	2500	Zener Diode Single 5.1V 2% 60Ohm 300mW Automotive 2-Pin SOD-323
K4AAG165WA-BCWE	SAMSUNG	22+	FBGA	1120	DRAM Chip DDR4 SDRAM 16Gbit 1Gx16 1.2V 96-Pin FBGA
PIC16F1459T-I/SS	MICROCHIP	22+	20-SSOP	2500	20-SSOP (0.209", 5.30mm Width) 48MHz 1K x 8 FLASH PIC 8-Bit I²C, LINbus, SPI, UART/USART, USB 14 14KB (8K x 14) 2.3V ~ 5.5V
K4A4G085WE-BCRC	SAMSUNG	22+	FBGA	1280	POD 1.2V DDR4 512*8
UCC27512DRSR	TI	22+	6-WDFN	2500	6-WDFN Exposed Pad Low-Side IGBT, N-Channel MOSFET 4A, 8A 4.5V ~ 18V 1V, 2.4V
K4A4G085WF-BCTD	SAMSUNG	22+	FBGA	1280	DRAM Chip DDR4 SDRAM 4Gbit 512Mx8 1.2V 78-Pin FBGA
LM317TG	ON	22+	TO-220AB	2500	Adjustable 1.2V 37V 1.5A 10mA TO-220AB 40V
K4A8G085WB-BCRC	SAMSUNG	22+	FBGA	1280	POD 1.2V DDR4 1024*8
VS-8EVX06-M3/I	VISHAY	22+	TO-252-3	2500	TO-252-3,SC-63,SC-63 8000mA 600V 3V@8000mA
K4A8G085WC-BCTD	SAMSUNG	22+	FBGA	1280	POD DDR4 1024*8

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